打造越南半导体未来：技术人才和创新飞轮

Public Disclosure Authorized © 2025 International Bank for Reconstruction and Development / The World Bank1818 H Street NWWashington DC 20433Telephone: 202-473-1000Internet: www.worldbank.org This work is a product of the staff of The World Bank with external contributions. The findings, interpretations, andconclusions expressed in this work do not necessarily reflect the views of The World Bank, its Board of Executive Directors,or the governments they represent. The World Bank does not guarantee the accuracy, completeness, or currency of the data included in this work and doesnot assume responsibility for any errors, omissions, or discrepancies in the information, or liability with respect to the use ofor failure to use the information, methods, processes, or conclusions set forth. The boundaries, colors, denominations, links/footnotes and other information shown in this work do not imply any judgment on the part of The World Bank concerningthe legal status of any territory or the endorsement or acceptance of such boundaries. The citation of works authored byothers does not mean the World Bank endorses the views expressed by those authors or the content of their works. Nothing herein shall constitute or be construed or considered to be a limitation upon or waiver of the privileges andimmunities of The World Bank, all of which are specifically reserved. Rights and Permissions The material in this work is subject to copyright. Because The World Bank encourages dissemination of its knowledge, thiswork may be reproduced, in whole or in part, for noncommercial purposes as long as full attribution to this work is given. Any queries on rights and licenses, including subsidiary rights, should be addressed to World Bank Publications, The World BankGroup, 1818 H Street NW, Washington, DC 20433, USA; fax: 202-522-2625; e-mail: pubrights@worldbank.org. FORGING VIET NAM’SSEMICONDUCTOR FUTURE A tech talent andinnovation flywheel CONTENTS ACRONYMS...................................................................................................................................................................................................VIACKNOWLEDGEMENTS....................................................................................................................................................................... VIIISCOPE NOTE................................................................................................................................................................................................. XEXECUTIVE SUMMARY.............................................................................................................................................................................XIA dynamic tech talent and innovation flywheel..................................................................................................................................................................xiViet Nam’s semiconductor moment: Moving up the ladder.....................................................................................................................................xiiiSemiconductor talent challenges: Extensive, intensive, and integrative margins.................................................................................... xivFive critical decisions for 2025......................................................................................................................................................................................................xvAn integrated roadmap to 2035: Objectives and proposals.................................................................................................................................. xviRisks & mitigation...............................................................................................................................................................................................................................xviiiJobs upside vs fiscal cost................................................................................................................................................................................................................xix PART I. THE CASE FOR ACTION: INVESTING IN THE BRAIN OF THE “BRAINS”.............. 1 1. VIET NAM’S SEMICONDUCTOR MOMENT: MOVING UP THE VALUE LADDER.................................................................... 21.1. Semiconductors, AI, technology convergence, and the tech talent race....................................................................................................21.2. Viet Nam’s semiconductor industry: the starting point...........................................................................................................................................51.3. Three windows for Viet Nam in upgrading the semiconductor value chain..............................................................................................71.4. Bottom