2025年电力电子行业现状报告

Status of the PowerElectronics Industry2025 Market and Technology Report TABLE OF CONTENTS1/3 Report objectivesIdentity cardPower Electronic Activity TeamCompanies citedWhat is new in the 2025 report editionWhat we got right, what we got wrongForecast comparison with the previous editionsMethodology and definitionsThree-page summaryExecutive summaryMarketdriversforpowerelectronics678910111213192347 oPower module market in $M, split by application (SiliconMOSFET, Silicon IGBT, overall power module market)oPower converter market in $M, split by application Marketdriversandtrends,byapplication84 Marketsharesandsupplychain96 oGeographic location of the main power semiconductorplayersoPower electronics supply chain and business modelsoPower device manufacturers’ revenue: 2024 ranking andpositioning on different device technologies Wafer supply chain104 oMain silicon wafer suppliers for power devices–geographiclocationo2024 silicon wafer supplier market sharesoSi wafers: M&As, key investments, partnerships,manufacturing capabilitieso2023-2022-2021SiCwafer supplier market shares, in $MoWBG wafers: M&As, key investments, partnerships,manufacturing capabilities 2020-2030Marketforecasts,bysegment54 oOverall power electronics market, in $M, by applicationsegment, by device and package type, by semiconductortypeoPower device market value in 2024 and 2030, split bydevice voltageoWafer market for power electronics (Si,SiC) inMunitsoPower bare die market inMunits, split by voltage class(Silicon MOSFET and IGBT)oDiscrete power device market in $M, split by application(Silicon MOSFET, Silicon IGBT, overall power discrete Power device supply chain110 oSemiconductor industry is struggling: layoffs and projectsdelayed or stopped.oPower electronics: Different ways to expand existingbusinessoKey global news: partnerships, M&As, key investmentsoM&A challenges in power electronics supply chain TABLE OF CONTENTS2/3 oSupply chain issues: Military & Defense applications, spaceapplicationsoHow to get access to Chinese customers oWhy are there so many players interested in the powermodule business?oOverview of different business models in power modulesoLocations of Power module packaging facilitiesoR&D and prototyping of power modulesoPower module packaging–new fabs and expansion ofexisting fabs Focus on Silicon supply chain oSilicon: Power electronics, Supply chain, and business modelsoMain silicon discrete manufacturers–Geographic regionsoSilicon power module manufacturers–Geographic regionsoSilicon IGBT power module top players’ shares in 2024, in $MoSilicon IGBT discrete device top players’ shares in 2024, in $MoSilicon MOSFET discrete device top players’ shares in 2024, in $MoSi: Recent acquisitions, investments and partnerships Passives supply chain154 oPassive components for the power applications landscapeoReshaping of the passive components supply chain Top 3 company profiles: Infineon Technologies,onsemi,STMicroelectronics157 Focus onSiCsupply chain131 oPowerSiCSupply Chain and business models at a glanceoMainSiCdevice manufacturers–Geographic regionso2024SiCdevice market sharesoSiC: Recent acquisitions, investments and partnerships Supply chain: focus on different regions (Greater China, Europe,Japan, USA, India, South Korea, Russia, Others)167 Technologytrends192 oDiversification of power component semiconductormaterialsoA complex choice of a power device for a power converter!oPower components competing with one anotheroManufacturing process flow for Si,SiCandGaNtechnologies-From starting material to power converter Focus onGaNsupply chain oPowerGaNSupply Chain and business models at a glanceoMainGaNdevice manufacturers–Geographic regionso2024GaNdevice market sharesoGaN: Recent acquisitions, investments and partnershipsoGaN-based onboard charger Wafer technology trends 197 Front-end silicon device manufacturing capacity plans for power electronics143 oSilicon wafer type vs device type, voltage and applicationoWhy go to manufacturing on larger diameter wafers? oPower module packaging, Supply chain, and business models TABLE OF CONTENTS3/3 oWhat is the future for small-diameter wafers (<200mm)?o6’’→8’’ transition alone will not solve theSiCwafer supply issuesoWafers for power devices–technology status and trendsoMain pain points for silicon wafer manufacturersoWafer diameter shares by component as of 2024oTypical device wafer thickness, by device type and voltage classoInfineon unveiled the world’s thinnest silicon power waferoWafer trends forSiCandGaNdevices oFocus on high-voltageSiC Power device packaging trends226 oTechnology trends in discrete power device packagingoDiscrete power device vs. power moduleoDiscrete devices moving to higher power levelsoShare of different power module designs, by company(encapsulation type)oTowards smaller power modulesoFrom power module to inverter sub-system (“powermodule on cooler”)oTrend toward very low stray inductance (<10nH)oWeldable module conne