Huawei Unveils AI Chip Roadmap toChallenge Nvidia’s Lead 华为公布挑战英伟达领先地位的⼈⼯智能芯⽚路线图 ByBloomberg News彭博社新闻September 18, 2025 at 11:35 AM GMT+8Updated on更新于September 18, 2025 at 5:05 PM GMT+8 BPC > disable Dark Reader or enableJavaScript for site BPC >禁⽤Dark Reader或为该站点启⽤JavaScript Takeawaysby Bloomberg AI 彭博AI的要点 Huawei Technologies Co. unveiled new technology,including SuperPod cluster designs and AI accelerators, tochallenge Nvidia Corp.'s dominance in the growing market. 华为技术有限公司公布了包括SuperPod集群设计和AI加速器在内的新技术,旨在挑战英伟达公司在这⼀增⻓市场中的主导地位。 The company's new SuperPod products will be built withnew generations of Ascend chips and high-bandwidthmemory designed by Huawei itself, with plans to roll out newmodels in 2027 and 2028. 该公司的新SuperPod产品将采⽤华为⾃⾏设计的新⼀代Ascend芯⽚和⾼带宽存储器制造,计划在2027年和2028年推出新型号。 Huawei's approach is seen as a significant milestone inChina's AI chipset industry, reflecting breakthroughs insystem design and interconnect technologies, and signals astronger push toward self-reliance and resilience in the faceof export restrictions. 华为的做法被视为中国⼈⼯智能芯⽚⾏业的⼀个重要⾥程碑,反映了在系统设计和互连技术⽅⾯的突破,并表示在出⼝限制⾯前更加强调⾃⼒更⽣和弹性。 Huawei Technologies Co.unveiled new technology frommemory chips to AI accelerators Thursday, outliningpublicly for the first time its multiyear plan to challengeNvidia Corp.’s dominance in a growing market. 华为技术有限公司周四公布了从存储芯⽚到⼈⼯智能加速器的新技术,⾸次公开阐述其多年计划,旨在在⽇益增长的市场中挑战Nvidia Corp.的主导地位。 The highlight of the company’spresentationon Thursdaywere new SuperPod cluster designs that will allow Huaweito link as many as 15,488 of its Ascend neural processingunits for artificial intelligence and operate them as acoherent system, rotating chairmanEric Xusaid at theevent. Those SuperPod products will be built with newgenerations of Ascend chips from next year. 公司周四发布会的亮点是新的SuperPod集群设计,轮值董事长徐直军在活动上表⽰,该设计将允许华为将多达15,488枚其Ascend神经处理单元⽤于⼈⼯智能的处理器连接起来并作为⼀个统⼀系统运⾏。这些SuperPod产品将从明年起搭载新⼀代Ascend芯⽚构建。 The next-generation Ascend 950 series will be accompaniedby new high-bandwidth memory designed by Huawei itself, Xu said, without elaborating on who will fabricate thesemiconductors. Huawei also plans to roll out an Ascend960 in late 2027, to be succeeded by a 970 model in late2028. 徐直军表⽰,新⼀代Ascend 950系列将配备由华为⾃⾏设计的新型⾼带宽存储器,但他未详细说明半导体将由谁代⼯。华为还计划在2027年末推出Ascend 960,并在2028年末推出Ascend 970机型。 “This is a significant milestone in China’s long march of theAI chipset industry,” said Charlie Dai, vice president atForrester Research. “This achievement reflectsbreakthroughs in system design, interconnect technologies,and local fabrication capabilities. It signals a stronger pushtoward self-reliance and resilience in the face of exportrestrictions.” “这是中国AI芯⽚⾏业长征中的⼀个重要⾥程碑,”ForresterResearch副总裁Charlie Dai表⽰。“这⼀成就反映了在系统设计、互连技术和本地制造能⼒⽅⾯的突破。它标志着在出⼜限制⾯前更加⾃⽴⾃强、增强韧性的进程。” Shenzhen-based Huawei is China’s most advanced chipdesigner and strongest contender to build alternatives toNvidia’s industry-leading AI hardware. Washington has foryears blocked the export of Nvidia’s top products to China,and Beijing recentlytoldits biggest tech companies not touse Nvidia’s RTX Pro 6000D, a graphics card forworkstations that can be repurposed for AI applications.The move marked a clear attempt by Chinese leaders towean the country off Nvidia hardware and boost domestic alternatives. 总部位于深圳的华为是中国最先进的芯⽚设计公司,也是最有⼒的竞争者,旨在打造替代英伟达⾏业领先AI硬件的⽅案。多年来,美国⼀直阻⽌向中国出⼜英伟达的顶级产品,北京最近要求其最⼤的科技公司不要使⽤英伟达的RTX Pro 6000D——这是⼀款可被改作AI⽤途的⼯作站显卡。此举明确表明中国领导层试图让国家摆脱对英伟达硬件的依赖并提升国内替代品的能⼒。 Read more about the US-China chip war阅读更多关于美中芯⽚战争的报道 China Tells Companies to Stop Buying Nvidia Chip With AI Uses中国要求企业停⽌购买⽤于⼈⼯智能的英伟达芯⽚Alibaba AI Chip Effort Quickens With Big Client China Unicom阿⾥巴巴加速AI芯⽚研发,重要客户中国联通推动进程China Targets Nvidia Over 2020 Deal, Straining Trade Talks中国因2020年交易盯上英伟达,加剧贸易谈判紧张局势Why World Powers Are Sparring Over Computer Chips: QuickTake为什么世界强国在为计算机芯⽚争⽃:QuickTake Like its US competitor, Huawei is developing systems thatcombine several of its AI chips into more capable clusters.The newly announced Atlas 950 SuperPod will deliver 6.7times more computing power than Nvidia’s upcomingNVL144 systems, Xu said. Huawei is also planning a supercluster with about 1 million graphic cards, based on the new SuperPod technology. 像其美国竞争对⼿⼀样,华为正在开发将多枚AI芯⽚组合成更强⼤集群的系统。徐表⽰,新公布的Atlas 950 SuperPod将⽐英伟达即将推出的NVL144系统提供6.7倍的计算能⼒。华为还计划基于新SuperPod技术建设⼀个约有100万块显卡的超级集群。 Earlier this year, company founderRen Zhengfeitold statenewspaper People’s Daily that Huawei still lags behind theUS in terms of output from a single chip, but “can still getthe results we want by compensating with cluster-basedcomputing.” 今年早些时候,公司创始⼈任正⾮在接受《⼈民⽇报》采访时表⽰,华为在单芯⽚产出⽅⾯仍落后于美国,但“可以通过以集群为基础的计算来弥补,从⽽达到我们想要的结果。” The aggressive approach helps China’s AI chip leader drawmore performance from its semiconductors, which face amanufacturing constraint as the company cannot readilyadvance to more sophisticated fabrication due to traderestrictions on leading-edge machinery. While short of a bigbreakthrough in chip technology, Huawei’s sol