2025年深度行业分析研究报告 内容目录 1、光刻工艺:芯片制造技术难度最大环节.........................................................................................................52、光刻机部件:光源、照明系统、投影物镜为核心组件..................................................................................123、光刻机市场:ASML、Nikon、佳能垄断.......................................................................................................253.1光刻机发展历程:步进扫描投影式光刻机为当前主流机型...................................................................253.2千亿级市场,海外三强垄断.................................................................................................................284、国内供应链厂商梳理...................................................................................................................................334.1上海微电子:国内光刻机整机制造厂商...............................................................................................334.2国科精密:专注高端曝光光学系统制造...............................................................................................334.3科益虹源:DUV光源制造商................................................................................................................344.4华卓精科:双工作台制造商.................................................................................................................354.5福晶科技:全球头部LBO晶体、BBO晶体供应商................................................................................364.6茂莱光学:先进光学镜头供应商..........................................................................................................374.7福光股份:光学元件供应商.................................................................................................................384.8汇成真空:国内镀膜设备供应商..........................................................................................................394.9腾景科技:深耕精密光学与光通信......................................................................................................404.10炬光科技:聚焦光子技术全链布局....................................................................................................414.11永新光学:全球领先光学显微镜厂商.................................................................................................424.12波长光电:国内精密光学元件、组件的主要供应商............................................................................434.13菲利华:深耕石英玻璃赛道...............................................................................................................44 图表目录 图表1:半导体制造八大步骤...........................................................................................................................5图表2:光刻示意图.........................................................................................................................................5图表3:光刻工艺基本步骤..............................................................................................................................6图表4:瑞利准则对分辨率定义.......................................................................................................................7图表5:光线通过透镜系统聚焦成像示意图,n为介质折射率,θ为镜头的聚光角度........................................7图表6:光刻光源世代演变..............................................................................................................................8图表7:投影物镜NA发展路径........................................................................................................................8图表8:物镜的焦距越短则孔径角越宽,从而获得更高的NA和分辨率.............................................................9图表9:OPC处理前后的图形及其曝光结果...................................................................................................10图表10:二元掩模版VS相移掩模版..............................................................................................................10图表11:光源掩模协同优化的计算结果.........................................................................................................10图表12:套刻误差原因.................................................................................................................................10图表13:ASML DUV产品矩阵.......................................................................................................................11图表14:ASML DUV产品战略.......................................................................................................................11图表15:ASML NXT:2100i与2150i产品情况..............................................................................................11图表16:光刻机整体结构图..........................................................................................................................12图表17:EUV光源功率发展..........................................................................................................................13图表18:击打锡液过程.................................................................................................................................13图表19:Cymer准分子激光器工作原理图.....................................................................................................13图表20:投影式光刻机的光学原理示意图.....................................................................................................14图表21:28nm节点扫描光刻机照明系统中继镜组结构图.................................................