华虹半导体2025年中期报告

(Incorporated in Hong Kong with limited liability)(Stock Code: 01347)（股份代號：01347）（於香港註冊成立之有限公司） In this interim report, unless the context otherwise requires, the following terms shall have the meanings set out below. the Board of Directors of the Company; the People’s Republic of China, but for the purpose of this interim reportand for geographical reference only, except where the context otherwiserequires, references in this interim report to “China” and the “PRC” do notinclude Taiwan, the Macau Special Administrative Region and Hong Kong; Hua Hong Semiconductor Limited, a company incorporated in Hong Kongwith limited liability on 21 January 2005; the ordinary share(s) of the Company which are listed on the STAR Marketand traded in RMB; the Securities and Futures Ordinance (Chapter 571 of the Laws of HongKong), as amended or supplemented from time to time; the Shanghai Stock Exchange; theScience and Technology Innovation Board of the Shanghai StockExchange; CORPORATE INFORMATION Board of Directors Hong Kong Legal Advisor Herbert Smith Freehills Kramer23/F, Gloucester Tower15 Queen’s Road CentralHong Kong, PRC Executive DirectorsJunjun Tang(Chairman)Peng Bai(President) Non-Executive DirectorsJun YeGuodong SunBo ChenChengyan Xiong Principal Banks China Construction Bank Shanghai BranchNo. 900 Lujiazui Ring RoadPudong New AreaShanghai, PRC Independent Non-Executive DirectorsStephen Tso Tung ChangKwai Huen Wong, JPSonglin Feng China Development Bank Shanghai BranchNo. 68 Puming RoadPudong New AreaShanghai, PRC Company SecretarySui Har Lee China Merchants Bank Co., Ltd. Shanghai BranchNo.1088 Lujiazui Ring RoadPudong New AreaShanghai, PRC Authorized RepresentativesJunjun TangSui Har Lee Audit CommitteeStephen Tso Tung Chang(Chairman)Chengyan XiongSonglin Feng ChinaConstruction Bank Corporation Hong KongBranch28/F, CCB Tower, 3 Connaught Road, CentralHong Kong, PRC Remuneration CommitteeKwai Huen Wong, JP(Chairman)Jun YeSonglin Feng Bank of Communications Co., Ltd. Hong Kong Branch20 Pedder Street, CentralHong Kong, PRC China Development Bank Jiangsu BranchNo. 232 Middle Jiangdong RoadNanjing, Jiangsu, PRC Nomination CommitteeJunjun Tang(Chairman)Kwai Huen Wong, JPSonglin Feng Agricultural Bank of China Wuxi Xinwu SubbranchNo. 26 Hefeng Road, Xinwu DistrictWuxi, Jiangsu, PRC Website ChinaConstruction Bank Wuxi High and NewTechnology Industrial Development Zone SubbranchNo. 26 Hefeng Road, Xinwu DistrictWuxi, Jiangsu, PRC www.huahonggrace.com Auditor Ernst & YoungCertified Public Accountants27/F, One Taikoo Place979 King’s Road, Quarry BayHong Kong, PRC China CITIC Bank Wuxi New District SubbranchNo. 26 Hefeng Road, Xinwu DistrictWuxi, Jiangsu, PRC Bankof China Wuxi High and New TechnologyIndustrial Development Zone SubbranchNo. 140 Wangzhuang Road, Xinwu DistrictWuxi, Jiangsu, PRC Bank of Communications Co., Ltd. Wuxi BranchNo.8 2nd Financial Street, Binhu DistrictWuxi, Jiangsu, PRC Share Registrar Hong Kong shares:Tricor Investor Services Limited17/F, Far East Finance Centre16 Harcourt RoadHong Kong, PRC A shares:China Securities Depository and Clearing Corporation Limited, Shanghai BranchNo. 188 South Yanggao RoadPudong New AreaShanghai, PRC Registered Office Room 2212, Bank of America Tower12 Harcourt Road, CentralHong Kong, PRC Principal Places of Business No. 288 Halei RoadZhangjiang Hi-Tech ParkShanghai, PRCPostcode: 201203 No. 30 Xinzhou RoadXinwu DistrictWuxi, Jiangsu, PRCPostcode: 214028 No. 30-1 Xinzhou RoadXinwu DistrictWuxi, Jiangsu, PRCPostcode: 214028 Stock Code Hong Kong Stock Exchange: 01347 Shanghai Stock Exchange: 688347 KEY FINANCIALS MANAGEMENT DISCUSSION AND ANALYSIS Revenue Revenue was US$1,107.0 million, an increase of 18.0% compared to 1H 2024, primarily driven by increased wafer Cost of sales Cost of sales was US$995.4 million, an increase of 15.9% compared to 1H 2024, primarily due to increased wafershipments and increased depreciation costs. Gross profit Gross profit was US$111.6 million, an increase of 40.0% compared to 1H 2024, primarily driven by improved capacityutilization, partially offset by increased depreciation costs. Other income and gains Other income and gains were US$59.9 million, a decrease of 15.7% compared to 1H 2024, primarily due to decreasedinterest income, partially offset by increased government subsidies. MANAGEMENT DISCUSSION AND ANALYSIS Administrative expenses Administrative expenses were US$190.2 million, an increase of 15.9% compared to 1H 2024, primarily due toincreased engineering wafer costs. Other expenses Other expenses were US$17.3 million, an increase of 25.2% compared to 1H 2024, primarily due to increased foreignexchange losses. Finance costs Finance costs were US$41.6 million a decrease of 15.9% compared to 1H 2024, primarily due to decreased interestrate of bank borrowings. Share of profits of associates Share of losses of associates were US$1.2 million, a decrease of 55.7% comp