中国车规级芯片产业白皮书

Contents 1 1.11.21.31.41.5 2 2.12.22.32.42.5 3 3.13.23.33.43.5 1.1 3-5 1.2 9 1.3 40~100300-8001.4:(//(/) 1.4 IC1/2 1.5 1.5 1.5 1.5 Contents 1.11.21.31.41.5 2 2.12.22.32.42.5 3 3.13.23.33.43.5 2.1 预计2025年、2030年中国乘用车市场规模分别超过2,600万辆、3,000万辆20301,100300 •300-5001,000 • L43,0002030450 2025NEV54%1,4002030NEV72%2,100 L3L4/L5630-1,000 •2025550• 2.2 MCUMCU30%70MCU300MCUMCU •MCU 2.2 AISoCSoC 2.2 IGBTSiCGaN IGBT MOSFETsSiCGaNMOSFET IGBTIGBT /(DC/AC)20%-30% Si MOSFET600~900VSiCSiCSiCSi IGBTSi MOSFET /(DC/AC)IGBT 2.2 •L2+ •//•60% 2.2 GBTB L1/L22030L4L5L4/L5ADASGBTBL5L120DRAM8NAND125TB •PMICBMSAC/DCDC/DCLDOIC •AFEBMSSOCSOH•800VAFEBMSAFE 2.2 •ADASIVI2.5G/5G/10GE/E •4G/5GOTA1TBOX•V2X1T-BOX•WIFI•GNSS•UWBNFC •CAN/LINFlexRayMOST•PHYSwitch40-50•SerDes•USB •10100L4/L580-120 •1-24-5 2.2 •T-BOXV2XESAMUWBNFC •202360%20264.680%202680002021-2026CAGR30% 2.2 •/DC/DCBMSAC/DCIGBTSi MOSFETSiCMOSFET GaNFET LED / •LCDLEDMini LED•10• ••DC/DCBMSAC/DC•200V400V800V •LED•LED/ADBLEDLEDMicroLEDLED200-300• •4000 1- MCUIDM 2-SOCSOC 2.41/5 2.42/5 2.43/5 2.44/5 2.45/5 Tier1 2.51/2 EDA 2.52/2 5%15% Contents 1.11.21.31.41.5 2 2.12.22.32.42.5 3 3.13.23.33.43.5 3.1 3.1 IC 3.2 IC 3.2 3.3 3.3 3.4 3.4 3.5 3.5 ••25•35•140•110 : ••• 5G BIAI7//6345+ https://auto.gasgoo.com/institute/ 1. 1. •(12/)()•(12/)()•(12/)()•(25/)() •7 2. ••• 2. ••• •••• 3. •• 4. 3. •••• ••• ··