电子行业周报：英伟达推出新款GPU H200，首次搭载HBM3e性能飞跃

1 ◆ ◆ ◆ ◆ ◆ ◆ H100 SXMH200 SXMFP6434 teraFLOPS34 teraFLOPSFP64 Tensor Core67 teraFLOPS67 teraFLOPSFP3267 teraFLOPS67 teraFLOPSFP32 Tensor Core989 teraFLOPS989 teraFLOPSBFLOAT16 Tensor Core1979 teraFLOPS1979 teraFLOPSFP16 Tensor Core1979 teraFLOPS1979 teraFLOPSFP8 Tensor Core3958 teraFLOPS3959 teraFLOPSINT8 Tensor Core3958 TOPS3960 teraFLOPSGPU memory80GB141GBGPU memory bandwidth3.35TB/s4.8TB/sDecoders7 NVDEC7 JPEG8 NVDEC7 JPEGMax thermal design power(TDP)Up to 700W(configurable)Up to 701W(configurable)Multi-instance GPUsUp to 7 MIGs @10GBeachUp to 7 MIGs@16.5GB eachForm factorSXMSXMInterconnectNVLink：900GB/s PCIeGen5: 128GB/sNVLink：900GB/s PCIeGen5: 128GB/sServer optionsNVIDIA HGX H100partner and NVIDIA-Certified Systemswith 4 or 8 GPUsNVIDIA DGX H100with 8 GPUsNVIDIA HGM H200partner andNVIDIA-CertifiedSystems with 4 or8 GPUsNVIDIA EnterpriseAdd-onAdd-on