2026年电池与组件技术趋势：TOPCon、HJT及BC太阳能电池与组件的关键发展

Key Developments In TOPCon, HJT & BCSolar Cells and Modules Authors: Shravan K. Chunduri, Michael Schmela Contents © TaiyangNews 2026All rights reserved.Cell & Module Technology Trends 2026 The text, photos and graphs in this report are copyrighted(cover photo credit: LONGi, AIKO). TaiyangNews does not guarantee reliability,accuracy or completeness of this report's content. TaiyangNews does not accept Cover Photo Credit:LONGi, AIKO Shravan K. Chundurishravan.chunduri@taiyangnews.infoMichael Schmelamichael.schmela@taiyangnews.info For Media Contacts and Queries:info@taiyangnews.info Publisher: TaiyangNews UG (haftungsbeschraenkt)Dieker Str. 2440468 Düsseldorf, Germany Disclaimer: This TaiyangNews report is intended for general informational purposes only. It does not constituteand should not be construed as technical, investment, legal, tax, or other professional advice.Readers are encouraged to consult with their own qualified advisors regarding any matters discussedin this report. This report is based on publicly available sources and other information believed tobe reliable. TaiyangNews makes no representations or warranties, express or implied, as to theaccuracy, completeness, timeliness, or reliability of the information contained herein. TaiyangNewsdisclaims any liability for any direct, indirect, incidental, or consequential damages arising from theuse of or reliance on the information contained in this report. TaiyangNews is under no obligation to Executive Summary The PV technology landscape, much like lastyear, reflects a mature ecosystem – one where 3cell architectures coexist at scale and continue toevolve side by side. Each technology continuesto advance along its own trajectory, while theboundaries between them are increasingly blurring.Innovations are becoming more cross-functional, level, enabling a multi-cut module layout. On themetallization front, stencil printing is one of themost notable developments. In parallel, alternativesolutions such as laser-transfer printing, silver- In the HJT segment, wafer thickness continues todecrease, with ~110 μm emerging as a practicalchoice. Process refinements, such as the introductionof thin oxide layers, contribute to improved currentgeneration. Metallization remains a key focus, with At the upstream end of the value chain, siliconremains a focal point, with continued efforts toreduce power consumption and impurity levels. WhileSiemens technology continues to dominate, GCL’sFBR process based on granular silicon is gainingtraction due to its lower processing temperature andreduced carbon footprint. In crystal growth, the focusis on larger ingots with improved quality and loweroxygen content. RCZ is emerging as the mainstream BC technology is also undergoing rapid evolution.The most interesting evolution of the BC structureis the Hybrid Interdigitated Back Contact (HIBC)cell developed by LONGi. This structure representsa strategic fusion of TOPCon-like and HJTtechnologies, each used for a different polarity on the At the module level, multi-cut designs are gainingprominence, supported by cell-level advances suchas edge passivation. Here, rather than cutting cellsinto 2, 3 to 4 slices are cut from fully processed cells,which helps reduce resistance losses and improvespower by about 5 to 10 W. At present, TOPCon gains TOPCon is progressing into its next-generationtechnology phase, with developments aimed atfurther reducing optical and electrical losses. Themajor configurational difference is the transition The 2 technologies gaining favor across allarchitectures are gapless layouts and full-areadesigns, which are increasingly being implemented to Another important aspect of this latest generationof TOPCon is edge passivation. Although thisprocess occurs at the cell level, the benefits of Enjoy reading our Cell & Module Technology Trends 2026 Shravan K. ChunduriHead of Technology, TaiyangNewsshravan.chunduri@taiyangnews.info+91 996 327 0005 Michael SchmelaManaging Director, TaiyangNewsmichael.schmela@taiyangnews.info+49 173 15 70 999Duesseldorf, Germany 1. Introduction as TOPCon+, featuring a series of innovativeoptimizations at the cell and module levels.Improvements at the cell level include high-levelrear-surface engineering with the adoption of thepoly-finger concept and optimized metallization withadvanced printing technologies. Edge passivation is Solar cell and module efficiencies have beensteadily rising year after year, driven by continuousimprovements across technologies. At the same Efficiency gains today no longer come solely fromthe cell. Increasingly, meaningful performance gainsare being unlocked through module design layoutstrategies combined with innovations in materials, Today’s PV technology landscape reflects arelatively mature ecosystem, with 3 cell architecturescoexisting in large-scale commercial production– of course, each enjoying a different stature andshare in global production. TOPCon – the industry’