
SK Hynix will open the first cleanroom at its new fab being built atYongin, South Korea on March next year, two months earlier than initially planned, TheElechas learned. TheElec获悉,SK海⼒⼠将在明年3⽉于韩国永仁新建的⼯⼚启⽤⾸个洁净室,⽐最初计划提前了两个⽉。 The chipmaker is taking a similar measure for its M15X fab at Cheongju, showing that it plans to accelerate the expansion of its DRAM production capacity. 该芯⽚制造商在位于清州的M15X⼯⼚也采取了类似举措,显⽰其计划加快DRAM产能扩张。 The acceleration of the phase one construction phase at Yongin, which was initially planned to be completed in May next year with the first cleanroomopening, is likely being done to meet the high demand for its high-bandwidth memory (HBM) chips, which are made out of DRAMs and used in AI chips. 永仁⼀期⼯程建设阶段的加速推进,原本计划于明年5⽉完成并启⽤⾸个洁净室,很可能是为了应对其⾼带宽存储(HBM)芯⽚的旺盛需求。HBM芯⽚由DRAM制成,并⽤于AI芯⽚。 SK Hynix is planning to build a total of four fabs at Yongin and these fabs will be larger than M15X. SK海⼒⼠计划在⻰仁建设共四座晶圆⼚,这些晶圆⼚的规模将⼤于M15X。 Equipment placement for the Yongin fab will start in the second quarter likely in April, sources said. TEMC CNS and STI will put in utilities before this, theysaid. 消息⼈⼠称,⻰仁晶圆⼚的设备进场将于第⼆季度开始,可能在4⽉。TEMC CNS和STI将在此之前进⾏公⽤设施的安装。 Last month, TEMC CNS said it has signed a 14.5 billion won deal with SK Hynix to supply central chemical supply system in turn-key. The size of the dealreflects the deposit and the total deal is worth 48.4 billion won, the company said. 上个⽉,TEMC CNS表⽰,已与SK海⼒⼠签署了⼀份价值145亿韩元的合同,以交钥匙⽅式供应中央化学品供应系统。该公司称,该合同⾦额反映了定⾦,项⽬总价值为484亿韩元。 Meanwhile, the schedule for phase two to three has also been accelerated, the sources said. Phase one was to go live in 2027, followed by phase two andthree in 2028 and 2029, respectively. But phase two will also go live by 2027 and phase three 2028, they said. 与此同时,第⼆⾄第三阶段的进度也已加快,消息⼈⼠表⽰。第⼀阶段原计划于2027年投产,第⼆和第三阶段分别于2028年和2029年投产。但他们表⽰,第⼆阶段也将于2027年投产,第三阶段则于2028年投产。