AI智能总结
目录 1概述·······························································································································11.1方案简介······················································································································11.2方案背景······················································································································11.3方案价值······················································································································22方案介绍·························································································································22.1部署介绍······················································································································22.1.1部署介绍·············································································································22.1.2可靠性部署··········································································································32.2方案核心组件介绍··········································································································42.2.1多通道无源分光器·································································································42.2.2多通道中心光模块·································································································52.2.3多通道接入光模块·································································································52.3技术实现······················································································································62.3.1核心技术·············································································································62.3.2工作原理·············································································································63方案对比·························································································································83.1.1传统以太方案VS多通道以太光方案··········································································83.1.2常规无源以太光VS多通道以太光方案·······································································83.1.3PON方案VS多通道以太光方案··············································································94网络改造和演进··············································································································104.1新建园区网络场景········································································································104.2传统以太网络升级改造场景····························································································114.3旧PON网络改造场景···································································································13 1概述 1.1方案简介 H3C多通道以太光方案(Multichannel Ethernet Network)基于WDM(波分复用)技术,通过在单根光纤上承载多个不同波长的光信号,实现物理隔离的并行数据传输。该方案支持100G分四路25G或40G分四路10G/2.5G,既实现接入层超高密度接入,又满足大带宽入室需求,为园区网络提供高效、可靠且节省成本的解决方案。 1.2方案背景 在数字化与智能化转型加速的背景下,园区网络正面临多重结构性挑战: •终端密度激增:物联网设备、移动终端及智能教学设施的规模化部署,导致传统网络在端口密度、接入速率、传输距离与电缆/光纤资源利用率上遭遇瓶颈;•业务动态性升级:4K/VR教学、AIoT管理等业务对网络提出弹性带宽需求,现有架构以太网络难以支撑频繁的业务变化和突发的流量增长;•OPEX(Operating Expense,运营成本)持续攀升:链路冗余部署带来的空间占用与运维复杂度,显著增加园区TCO(总拥有成本)。 为应对如上挑战,H3C创新推出多通道以太光方案(Multichannel Ethernet Network),助力园区网络打破困局。 1.3方案价值 H3C多通道以太光方案在园区网络建设方面展现出显著价值,主要体现在: •超高密度接入和大带宽入室:1U盒式设备支持120+房间接入,最高25G速率,波长级硬管道隔离保障带宽独享,满足4K/VR教学、AIoT管理等业务的高吞吐、低时延需求。•平滑的带宽升级:支持从2.5G和10G平滑升级至25G速率,为用户提供多样化的带宽选择,满足不同业务场景下的网络需求。方案具备良好的可扩展性,便于用户根据未来业务发展灵活调整和扩展网络带宽,实现投资的持续增值。•统一无源光网络(ODN)架构:多通道以太光方案采用无源ODN架构,利用单根光纤进行多通道数据传输,无需楼层弱电间,简化了网络结构,降低了室内光纤的使用量,减少了施工难度和成本。多通道以太光方案的传输网络与PON网络兼容,支持在PON网络的基础上进行升级改造,实现了从PON网络到多通道以太光方案的过渡,为用户提供更加高效的网络服务。•简化网络架构:采用单根光纤多通道数据并行传输方式,优化了数据传输方式,显著提高了传输效率和稳定性。该方案减少汇聚设备数量和光纤使用量,有效降低了网络的部署成本和辅材成本,为用户提供了更加经济性的网络解决方案。•多网管平台兼容:支持第三方网管平台,实现多厂商设备统一管理,提升运维效率。综上所述,H3C多通道以太光方案为园区网络提供高效、可靠、灵活且经济的解决方案。 2方案介绍 2.1部署介绍 2.1.1部署介绍 H3C多通道以太光方案组网实现如图1所示。主要部署组件及辅材,包括多通道交换机(多通道盒式交换机或多通道板卡+框式交换机)、多通道中心光模块、多通道接入光模块、多通道无源分光器和光纤,组件部署说明如表1所示。 2.1.2可靠性部署 多通道无源分光器的COM口作为上行接口,用于连接主干光纤。该接口包含A、B两个物理端口,支持冗余备份功能。当其中一路失效时,另一路可作为备用链路。如图2所示,多通道无源分光器的A、B口分别连接2个多通道交换机,A口作为主用链路,B口作为备份链路,确保主干链路可靠性。 多通道无源分光器不支持做主备切换,需要在多通道交换机上进行主备配置。 2.2方案核心组件介绍 多通道以太光方案的核心组件包括:无源分光器、多通道核心光模块和多通道接入光模块。 2.2.1多通道无源分光器 多通道无源分光器负责光信号传输,外观如图1所示。它包含4组2分4分光器,每组分光器上行口支持主备两路,下行口支持4路分光。光信号下行时,负责将多通道中心光模块传递过来的光分发给多通道接入光模块。信号上行时,负责将多通道接入光模块发射过来的光汇聚转发给多通道中心光模块。 COM口作为上行口,用于连接主干光纤。该接口包括A、B两个物理口,支持冗余备份功能。 2.2.2多通道中心光模块 多通道中心光模块外观如图2所示,在多通道方案中,该光模块的重要功能是光信号的分波与合波。发送光信号时,该光模块作为“合波器”,将四路光信号合成一路发送给无源分光器。接收光信号时,该光模块作为“分波器”,将一路光信号解波为四路光信号,进而转换为电信号发送给多通道交换机。 2.2.3多通道接入光模块 多通道接入光模块外观如图3和图4所示,在多通道方案中,该光模块的重要功能是光信号的滤波。接收光信号时,该光模块作为“滤波器”,将多通道中心光模块发来的四通道光进行过滤,仅保留该光模块需要通道的光,然后转发给设备。 多通道光模块四个为一组,四个光模块标签颜色不同,每种颜色对应不同的中心波长。光模块使用时,同一组内不能出现相同标签颜色的光模块。 2.3技术实现 2.3.1核心技术 多通道以太光方案基于单纤多波长并行传输技术,通过一根光纤承载多个独立数据通道,实现超高密度接入和大带宽传输。其核心技术包括: •多波长复用:采用WDM(波分复用)技术,在单根光纤上同时传输八个波长通道信号,即下行四个波长通道、上行四个波长通道。每个通道相邻波长间隔20nm,每个波长对应一路独立数据流,互不干扰。•双向通信:利用不同波长实现上下行数据的双向传输,减少光纤数量。•无源分光架构:通过2:4无源分光器将汇聚侧信号分发至多个接入点,支持冗余备份,无需额外供电或管理。 2.3.2工作原理 1.下行分波 信号发射:多通道中心光模块将电信号转换为不同波长的光信




