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aehr测试系统2024年度报告

2025-07-28 美股财报 郭小欧
报告封面

AEHR TEST SYSTEMS(Exact name of registrant as specified in its charter)California94-2424084(State or other jurisdiction of(IRS Employer 400 KATO TERRACE,FREMONT,CA(Address of principal executive offices) Indicate by check mark if the registrant is a well-known seasoned issuer, as defined in Rule 405 of the Securities Act.☐Yes Indicate by check mark whether the registrant has submitted electronically every Interactive Data File required to be submittedpursuant to Rule 405 of Regulation S-T (§232.405 of this chapter) during the preceding 12 months (or for such shorter period that the Indicate by check mark whether the registrant is a large accelerated filer, an accelerated filer, a non-accelerated filer, a smaller reporting company,” and “emerging growth company” in Rule 12b-2 of the Exchange Act:Large accelerated filer☐Accelerated filer☐Non-accelerated filer☒Smaller reporting company☒ 1(b).☐Yes☒No The aggregate market value of the registrant’s common stock, par value $0.01 per share, held by non-affiliates of theregistrant, based upon the closing price of $11.89 on November 29, 2024, as reported on the NASDAQ Capital Market, was DOCUMENTS INCORPORATED BY REFERENCE: reference into Part III of this Annual Report on Form 10-K where indicated. Such Definitive Proxy Statement will be filed with theSecurities and Exchange Commission within 120 days after the end of the registrant’s fiscal year ended May 30, 2025. future operations, are forward-looking statements. The words “believe,” “may,” “will,” “estimate,” “continue,” “anticipate,” “plan,”“intend,” “expect,” “could,” “target,” “project,” “should,” “predict,” “potential,” “would,” “seek” and similar expressions and thenegative of those expressions are intended to identify forward-looking statements. These forward-looking statements are subject to anumber of risks, uncertainties and assumptions that are difficult to predict. Therefore, actual results may differ materially andadversely from those expressed in any forward-looking statements. These risks include but are not limited to those factors identified in“Risk Factors” beginning on page [13] of this Annual Report on Form 10-K, those factors that we may from time to time identify inour periodic filings with the Securities and Exchange Commission, as well as other factors beyond our control. We undertake noobligation to revise or update publicly any forward-looking statements for any reason. Unless the context requires otherwise,references in this Form 10-K to “Aehr Test,” the “Company,” “we,” “us” and “our” refer to Aehr Test Systems. possible that the information we post on our investor relations website could be deemed to be material information. Therefore, weencourage investors, the media, and others interested in our company to review the information we post on our investor relations3 headquartered in Fremont, California. We are a leading provider of test solutions for testing, burning-in, and stabilizing semiconductordevices in wafer level, singulated die, and package part form, and have installed thousands of systems worldwide. Mission critical applications are driving increased quality, reliability, safety, and security needs of semiconductors. The applications include artificialintelligent (“AI”) compute data centers, electric vehicles, electric vehicle charging infrastructure, solar and wind power, data andtelecommunications infrastructure, and solid-state memory storage. The trend is driving additional test requirements, incrementalcapacity needs, and new opportunities for Aehr Test products and solutions. We have developed and introduced several innovative and burn-in systems that can test, burn-in, and stabilize a wide range of devices such as leading-edge silicon carbide-based and galliumnitridepower semiconductors,2D and 3D sensors used in mobile phones,tablets,and other computing devices,memorysemiconductors, processors, microcontrollers, systems-on-a-chip, and photonics and integrated optical devices used in AI. The FOX-CP system is a low-cost single-wafer compact test solution for logic, memory and photonic devices and the newest addition to theFOX-P product family. The FOX WaferPak Contactor contains a unique full wafer contactor capable of testing wafers up to 300mmthat enables integrated circuits (“ICs”), manufacturers to perform test, burn-in, and stabilization of full wafers on the FOX-P systems.The FOX DiePak Carrier allows testing, burn-in, and stabilization of singulated bare die and modules up to 1,024 devices in parallelper DiePak on the FOX-NP and FOX-XP systems up to nine DiePaks at a time. The introduction of the High Power FOX-XP inconnection with the acquisition of Incal Technology, Inc. (“Incal”), our new line of high-power packaged part reliability/burn-in test Semiconductor manufacturing is a complex, multi-step process, and defects or weaknesses that may result in the failure of a semiconductor device may be introduced at any process step. Failures may occur