H3C 800G 以太网技术白皮书

目录 1.1简介······················································································································································ 11.2技术验证案例········································································································································ 11.3 800G以太网优势·································································································································· 11.4 H3C 800G网络平滑升级方案·············································································································· 22800G网络产品关键技术介绍···················································································································22.1高速链路技术········································································································································ 2800G系统对高速链路的需求····································································································· 22.1.1H3C 800G系统高速链路技术实现····························································································· 32.1.22.2功耗控制技术········································································································································ 5优化系统链路设计······················································································································ 52.2.1低功耗芯片技术························································································································· 52.2.2低功耗光模块技术······················································································································ 52.2.32.3 CPO技术············································································································································· 8技术原理···································································································································· 82.3.1技术优势···································································································································· 82.3.2综述··········································································································································· 92.3.32.4散热技术··············································································································································· 9芯片散热···································································································································· 92.4.1光模块散热······························································································································· 102.4.2高性能风扇······························································································································· 102.4.32.5供电方案············································································································································· 10 3.1 800G封装形态··································································································································· 113.2常见的800G模块规格······················································································································· 12800G OSFP800光模块规格···································································································· 123.2.1800G QSFP-DD800光模块规格······························································································ 123.2.23.3 H3C 800G光模块/线缆产品··············································································································· 13 4H3C 800G交换机典型组网应用············································································································14 超大规模800G互联数据中心应用··························································································· 144.1.1超大规模800G互联无损RDMA组网······················································································ 154.1.2 1800G以太网简介 1.1简介 随着大数据、云计算、AI（Artificial Intelligence，人工智能）等技术的高速发展，全球数据流量持续呈现指数级增长。无论是在互联网服务、智能制造，还是在AI大模型训练等前沿应用中，网络对更高带宽、更低延迟、更稳定连接的需求已成为不可回避的趋势。在此背景下，800G以太网应运而生，作为新一代以太网技术的重要里程碑，它在400G的基础上扩展至800G数据传输速率，能够同时处理更多的数据流与网络连接，从而显著提升数据传输和处理效率，优化用户体验。 在大模型的训练与推理过程中，训练集群中的服务器节点需要进行海量参数的数据交换，规模可达数万台服务器并发运作，计算负载与数据吞吐量均呈爆炸式增长。此时，交换机的性能成为决定整体网络效率与响应速度的关键，而传统的400G以太网架构已经逐渐逼近性能瓶颈。800G以太网凭借更高带宽和更高端口密度，能够有效缩短训练周期、降低通信延迟，从而显著提升整体算力效率。 当前，数据中心作为全球数据存储与计算核心，正面临着流量激增与延迟敏感的双重挑战。800G以太网不仅提升了数据中心的吞吐能力，还能通过更高端口集成度和能效优化，满足高密度布线和大规模部署的需求。 1.2技术验证案例 新华三联合思博伦通信，完成了业界首个密度高达64个800G端口的大规模H3C 800G CPO（Co-Packaged Optics，光电共封装）硅光交换机测试，标志着商用800G网络设备迈入全新阶段。测试表明，800G CPO硅光交换机产品在整机交换容量、全端口100%线速转发、传输时延等关键指标上均实现了卓越的可靠性和稳定性。尤其是在云计算等对网络质量极为敏感的场景中，能够为算力加速、应用性能提升提供强大支撑。 在该测试中，800G CPO硅光交换机单端口传输平均时延仅1.085微秒，比上一代产品降低约20%，达到业内领先水平。CPO技术通过将光引擎和交换芯片装配在同一个插槽上形成共封装，大幅缩短了芯片到光模块的高频电信号互联距离，降低信道损耗并提升信号完整性，使大型AI集群中的GPU（Graphics Processing Unit，图形处理单元）计算效率提升可达25%。 未来，随着AI应用的进一步普及和计算架构的演进，800G乃至1.6T的高速网络将成为支撑超大规模分布式计算的核心技术。 1.3 800G以太网优势