晶门半导体中期报告2025

INTERIMREPORT2025 CONTENTS目錄 1Corporate Profile公司簡介2Financial Highlights財務摘要3Interim Condensed Consolidated Statement of Profit or Loss中期簡明綜合損益表4Interim Condensed Consolidated Statement of Comprehensive Income中期簡明綜合全面收入表5Interim Condensed Consolidated Statement of Financial Position中期簡明綜合財務狀況表6Interim Condensed Consolidated Statement of Changes in Equity中期簡明綜合權益變動表7Interim Condensed Consolidated Statement of Cash Flows中期簡明綜合現金流量表8Notes to the Interim Condensed Consolidated Financial Information中期簡明綜合財務資料附註27Independent Review Report獨立審閱報告29Chief Executive Officer’s Message行政總裁的話33Management Discussion and Analysis管理層討論及分析44Directors’ Interests董事權益45Substantial Shareholders’ Interests主要股東權益46Share Option Scheme購股權計劃49Corporate Governance and Supplementary Information企業管治及補充資料51Definitions and Glossary釋義及詞彙53Corporate and Shareholder Information公司及股東資料 CORPORATE PROFILE公司簡介 晶門半導體有限公司及其附屬公司為一家具領導地位的半導體集團，專門設計、開發及銷售集成電路晶片產品及系統解決方案，能廣泛應用於智能手機、平板電腦、電視╱顯示器、筆記本電腦以及其他智能產品，包括可穿戴產品、電子貨架標籤、醫療保健產品、智能家居產品，以及工業用設備等提供廣泛的顯示及觸控應用。 SolomonSystech(International)Limited and itssubsidiaries as a group is a leading semiconductorgroupspecialising in the design,development andsalesof integrated circuits products and systemsolutions that enable a wide range of display and touchapplications for smartphones, tablets, TVs/monitors,notebooksand other smart devices,includingwearables, electronic shelf labels (ESLs), healthcaredevices, smart home devices, as well as industrialappliances, etc. VISION 為每個顯示系統提供最終的晶片解決方案 Provide the ultimate silicon solutionfor every display system FINANCIAL HIGHLIGHTS財務摘要 Interim Dividend 晶門半導體有限公司的董事會不建議宣派截至2025年6月30日止6個月的中期股息。 The Board of Solomon Systech (International) Limited(the “Company”) does not recommend the payment ofan interim dividend for the six months ended 30 June2025 (the “Period”). Unaudited Interim Results 董事會欣然宣佈，本公司及其附屬公司（統稱「本集團」）截至2025年6月30日止6個月的未經審核簡明綜合中期業績連同上年度同期的比較數字列載如下。 TheBoard is pleased to announce the unauditedcondensedconsolidated interim results of theCompany and its subsidiaries (collectively referred toas the “Group”) for the six months ended 30 June2025 together with the comparative figures for thecorresponding period as follows. INTERIM CONDENSED CONSOLIDATED STATEMENT OF PROFIT OR LOSS中期簡明綜合損益表 For the six months ended 30 June 2025截至2025年6月30日止6個月 INTERIM CONDENSED CONSOLIDATED STATEMENT OF COMPREHENSIVE INCOME中期簡明綜合全面收入表 For the six months ended 30 June 2025截至2025年6月30日止6個月 INTERIM CONDENSED CONSOLIDATED STATEMENT OF FINANCIAL POSITION中期簡明綜合財務狀況表 INTERIM CONDENSED CONSOLIDATED STATEMENT OF CHANGES IN EQUITY中期簡明綜合權益變動表 For the six months ended 30 June 2025截至2025年6月30日止6個月 INTERIM CONDENSED CONSOLIDATED STATEMENT OF CASH FLOWS中期簡明綜合現金流量表 For the six months ended 30 June 2025截至2025年6月30日止6個月 NOTES TO THE INTERIM CONDENSED CONSOLIDATED FINANCIAL INFORMATION中期簡明綜合財務資料附註 1. 1.General information 晶門半導體有限公司及其附屬公司為無晶圓廠半導體集團，專門設計、開發及銷售集成電路晶片產品及系統解決方案，能廣泛應用於智能手機、平板電腦、電視╱顯示器、筆記本電腦以及其他智能產品，包括電子貨架標籤，可穿戴產品、醫療保健設備、智能家居設備，以及工業用設備等作各類顯示及觸控應用。 Solomon Systech (International) Limited and itssubsidiariesare fabless semiconductor groupspecialising in the design, development and salesof integrated circuits (“IC”) products and systemsolutionsthat enable a wide range of displayapplications for smartphones, tablets, smart TVs/monitors, notebooks and other smart devices,includingelectronic shelf-labels(“ESLs”),wearables,healthcare devices,smart homedevices, as well as industrial appliances, etc. 本公司於2003年11月21日根據開曼群島公司法（1961年法律3，經綜合及修訂）第22章在開曼群島註冊成立為一間獲豁免有限公司。本公司註冊辦事處的地址為P.O. Box 31119, Grand Pavilion Hibiscus Way,802 West Bay Road, Grand Cayman KY1-1205，開曼群島（於2024年12月31日生效），而其香港總辦事處的地址為香港新界沙田香港科學園科技大道東3號無線電中心6樓607-613室。 The Company was incorporated in the CaymanIslands on 21 November 2003 as an exemptedcompany with limited liability under Cap. 22, theCayman Islands Companies Law (Law 3 of 1961,as consolidated and revised). The address of itsregistered office is P.O. Box 31119, Grand PavilionHibiscus Way, 802 West Bay Road, Grand CaymanKY1-1205, Cayman Islands (with effect from 31December 2024) and the address of its principaloffice in Hong Kong is Unit 607-613, 6/F. WirelessCentre, 3 Science Park East Avenue, Hong KongScience Park, Shatin, New Territories, Hong Kong. The Company has been listed on the Main Boardof The Stock Exchange of Hong Kong Limitedsince8 April 2004. This interim condensedconsolidated financial information is presented inUS dollars, unless otherwise stated. 本公司自2004年4月8日起，在香港聯合交易所有限公司主板上市。除另有列明外，本中期簡明綜合財務資料均以美元作呈列單位。 Theinterim condensed consolidated financialinformation has been reviewed but not audited,and it was approved for issue on 13 August 2025. 本中期簡明綜合財務資料乃經審閱但未經審核，並於2025年8月13日獲批准刊發。 2. 2.Basis of preparation Theinterim condensed consolidated financialinformation for the six months ended 30 June2025of the Group has been prepared inaccordancewith HKAS 34 Interim FinancialReportingas issued by the Hong Kong Institute ofC e r t i f